Tailored Adhesives for Damage Tolerant Joints

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,906.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
F33615-02-M-5613
Award Id:
57581
Agency Tracking Number:
021ML-2561
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
112 Naylon Avenue, Livingston, NJ, 07039
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
067504134
Principal Investigator:
Harry Katz
President
(973) 994-4334
udcliv@msn.com
Business Contact:
Harry Katz
President
(973) 994-4334
udcliv@msn.com
Research Institute:
n/a
Abstract
"Our main objective will be to develop and improve the integrity and reliability of aerospace- grade adhesives in bonded joints. This will increase ballistic survivability and allow reduction of fasteners with subsequent savings in cost and weight. UDCwill develop methods to align short fibers in a perpendicular direction on an adhesive layer. These aligned short fibers will provide superior strength joints when we develop methods for the reliable application and controlled orientation of thisreinforced adhesive layer for various joint configurations. UDC will prove the feasibility and potential advantages of the new reinforced adhesives and processing methods during this Phase I program. UDC will fabricate and test mechanical propertiesand demonstrate the concepts and fabrication of cost and weight efficient quality joints. The concept will be demonstrated by the fabrication and testing of small structural parts. At the end of Phase I, we will provide a report with results andconclusions, and a Phase II plan, schedule and cost estimate. This program will provide adhesives to improve the integrity and reliability of bonded joints. This will increase ballistic survivability and allow reduction of fasteners with subsequent savings in cost and weight. Adhesives are in widespread usethroughout the commercial sector as well as in defense. Examples are: automobile components, medical devices, electronic devices,

* information listed above is at the time of submission.

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