Flexible Electronics for Rugged, Low Power Army Systems

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911QX-07-C-0008
Agency Tracking Number: A062-061-1450
Amount: $119,995.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solitcitation Year: 2006
Solitcitation Topic Code: A06-061
Solitcitation Number: 2006.2
Small Business Information
VERSATILIS LLC
488 Ridgefield Rd, Shelburne, VT, 05482
Duns: 145965310
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ajay Jain
 Chief Technical Officer
 (650) 380-4763
 ajay@vrstls.com
Business Contact
 George Powch
Title: President + CEO
Phone: (802) 985-4009
Email: george@vrstls.com
Research Institution
N/A
Abstract
Performance of current amorphous (A-Si) and even polycrystalline (Poly-Si) silicon thin film transistors (TFTs) made with low temperature processes (<200°C) on flexible polymer substrates cannot meet requirements for applications such as AM backplanes for flexible displays or other flexible electronics in rugged, low cost Army systems of the future. While A-Si and Poly-Si TFTs can be successfully processed > 300°C on rigid glass or metal foil substrates with acceptable performance and yield, this is too high for traditional plastic substrates. Versatilis proposes to show high performing top gate based TFTs made of Zinc Oxide (ZnO) as an alternate semiconductor material, and made directly on a flexible polymer sheet at < 200°C. Such TFTs will be further patterned to <2μ features for high switching speeds using a novel multiwavelength photolithographic technique that will obviate sequential masking steps and fully eliminate registration and alignment challenges in working with flexible polymer substrates, and which will be compatible with a future R2R manufacturing paradigm for very low cost flexible electronics. Proposer will partner with the Display Research Lab at Lehigh University and adapt existing designs and techniques for Silicon based TFTs on metal foils to ZnO based TFTs on plastic.

* information listed above is at the time of submission.

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