High Resolution, 15-micron thin, Pixellated, Back-illuminated SOI CMOS Vertex Sensor

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$650,000.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
DE-FG02-07ER84919
Award Id:
84295
Agency Tracking Number:
83216
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
12725 SW Millikan Way, Suite 230, Beaverton, OR, 97005
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
124348652
Principal Investigator:
George Williams
Mr
(971) 223-5646
georgew@voxtel-inc.com
Business Contact:
George Williams
Mr
(971) 223-5646
georgew@voxtel-inc.com
Research Institution:
n/a
Abstract
Planned high energy physics (HEP) experiments require improvements in detector technology characterized by improved parameters for granularity, readout speed, radiation hardness and sensor thickness. Of the available detector technologies, Complementary Metal Oxide Semiconductor (CMOS) pixilated imagers offer several advantages, but CMOS detectors, due to readout and fixed pattern noise, have not been widely used for scientific instrumentation. They are also difficult to thin. The goal of this project is to overcome the limitations of contemporary SOI (silicon-on-insulator) CMOS active pixel sensor (APS) technology, in a 3-dimensional stacked imager configuration, by establishing a new class of back-thinned, radiation-hard, stacked Silicon on Insulator/ SOI CMOS HEP imagers. The Phase I project successfully fabricated and thinned photodetectors to the required specifications and uniformity. This addresses one of the major technical hurdles being addressed by the HEP detector community. The Phase II project will further investigate the technologies necessary to develop these high-performance detectors. Commercial Applications and other Benefits as described by the awardee: In the past, developments in HEP instrumentation have found widespread application in other fields. This project will open up a new approach to radiological imaging, protein crystallography, time resolved x-ray synchrotron science, electron microscopy, laser radar, and others.

* information listed above is at the time of submission.

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