MODELING OF 3-D DIFFRACTION AND SCATTERING FROM SUBMICRON OBJECTS ON SILICON FOR PARTICULATE MONITORING AND PHOTOLITHOGRAPHY

Award Information
Agency:
National Science Foundation
Branch:
N/A
Amount:
$236,000.00
Award Year:
1987
Program:
SBIR
Phase:
Phase II
Contract:
N/A
Agency Tracking Number:
2710
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Weidlinger Associates
333 Seventh Ave, New York, NY, 10001
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 Greogory L Wojcik
 Associate
 (415) 857-0960
Business Contact
Phone: () -
Research Institution
N/A
Abstract
IN PHASE I, WE PROPOSES TO USE THREE-DIMENSIONAL NUMERICAL SOLUTIONS OF MAXWELL'S EQUATIONS TO SHOW THAT DIFFRACTION AND SCATTERING PROBLEMS IN PHOTOLITHOGRAPHY AND DEFECT INSPECTION CAN BE ADDRESSED BY ANALYSIS. THESE SOLUTIONS WILL DEVELOP DATA OF GREAT BENEFIT TO MANUFACTURERS OF INTEGRATED CIRCUITS. THE MODELING OF 3-D DIFFRACTION AND SCATTERING PATTERNS BEARS ON THE FOLLOWING TOPICS: 1. THE PRINTABILITY OF DEFECTS AS CAUSED BY PARTICLES FALLING ON THE WAFER DURING INTEGRATED CIRCUIT PROCESSING AND FABRICATION. 2. PARTICULATE MONITORING DURING ALL STAGES OF INTEGRATED CIRCUIT WAFER FABRICATION. ALTHOUGH NUMERICAL SOLUTIONS TO MAXWELL'S EQUATIONS HAVE BEEN AVAILABLE FOR SOME TIME, TO APPLY SUCH METHODS IN 3-D REQUIRES SUPERCOMPUTERS. THE PHASE I CALCULATIONS WILL BE PERFORMED USING WEIDLINGER ASSOCIATES' VECTORIZED SOFTWARE ON A CRAXY X-MP SUPERCOMPUTER. NUMERICAL RESULTS WILL BE COMPARED WITH EXPERIMENTAL DATA PERTAINING TO PARTICULATE MONITORING. THESE EXPERIMENTS, TO BE CONDUCTED BY TENCOR INSTRUMENTS, WILL MEASURE THE ANGULAR SCATTERING PATTERN FROM SPHERES ON A SUBSTRATE. THIS WORK APPLIES TO EVALUATING PRINTABILITY OF DEFECTS IN INTEGRATED CIRCUITS AND TO PARTICULATE MONITORING DURING ALL STAGES OF IC WAFER FABRICATION. THESE PROBLEMS ARE INHERENTLY THREE-DIMENSIONAL. A STUDY OF THESE EFFECTS WOULD BE OF GREAT BENEFIT TO THE IC INDUSTRY.

* information listed above is at the time of submission.

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