DIAMONDLIKE CARBON HERMETIC ENCAPSULANTS

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 13129
Amount: $348,217.00
Phase: Phase II
Program: SBIR
Awards Year: 1991
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
315 S 9th St - Ste 22, Lincoln, NE, 68508
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dr John A Woollam
 (402) 477-7501
Business Contact
Phone: () -
Research Institution
N/A
Abstract
DIAMONDLIKE CARBON (DLC) CAN BE DEPOSITED ON ROOM TEMPERATURE SUBSTRATES. FURTHERMORE, EXPERIMENTS ON SILICON SUBSTRATES HAVE SHOWN THAT MOISTURE DOES NOT PENETRATE DLC FILMS AS THIN AS 150 ANGSTROMS. THE PURPOSE OF THE PROPOSED WORK IS TO DETERMINE IF THIN FILMS OF DLC CAN PROTECT COMPLETE ELECTRONIC DEVICES AND INTEGRATED CIRCUITS FROM MOISTURE, AS WELL AS FROM CHEMICALS CONTAINED IN COMMON EPOXIES USED FOR POTTING. THESE DEVICES CONTAIN POLY-SILICON, SILICIDES, METALS, AND DIELECTRIC FILMS WHICH ALL HAVE DIFFERENT THERMAL EXPANSION COEFFICIENTS AND STICKING COEFFICIENTS FROM DLC ADHESION. THUS (A) MOISTURE AND CHEMICAL PROTECTION, (B) BONDING UNDER CONDITIONS OF THERMAL CYCLING, AND (C) STEP COVERAGE WILL BE PRIMARILY ADDRESSED IN PHASE I.

* Information listed above is at the time of submission. *

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