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Advanced Packaging Technology for RF MEMS
Title: Chief Technical Officer
Phone: (562) 495-6090
Title: V.P. Engineering
Phone: (562) 495-6090
XCom Wireless is developing a novel packaged RF MEMS relay that can be incorporated into a wide variety of RF systems. The primary goal of this program is to develop these relays such that the relay actuator is encapsulated between an RF circuit and aprotective package; the circuit and package are integral parts of the relay itself. The relay structure combines an RF circuit, actuator, control ASIC, and package coverplate in a way that promises the superior RF performance typically found only infully integrated devices while retaining the manufacturing and design flexibility inherent to discrete components. The package provides electromagnetic interference shielding and a hermetic seal for complete environmental protection against humid orcorrosive conditions. This novel XCom Wireless design promises military ruggedness combined with RF design flexibility for high performance integrated systems.Commercialization of the technology to be developed in the present SBIR proposal represents afundamental component of the XCom Wireless business strategy. RF MEMS relays with environmentally secure packaging and low insertion loss are enabling elements for each XCom Wireless product, and sales revenue for all subsequent products may be attributedto the present initiative research. The estimated time to first product release is 18 months, with profitability possible in three years with sales estimates of 200,000 units at $10-30 each from defense industry customers. Production facilities requireexpansion by the end of the fifth year of operation to deliver high-volume products for consumer applications; this expansion is likely to require an initial public offering at that time. A strategy of continuous patent development is instrumental to XComWireless growth and strength in the RF community, with two or three patents expected to result from the Phase II effort of this proposal.
* Information listed above is at the time of submission. *