Very High Thermal Conductivity Micro-Filaments

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 18009
Amount: $64,825.00
Phase: Phase I
Program: SBIR
Awards Year: 1992
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
15257 N.e. 90th St., Redmond, WA, 98052
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Richard B. Minch
 (206) 881-2797
Business Contact
Phone: () -
Research Institution
N/A
Abstract
Electronic cooling, micro-chip cooling and advanced materials all suffer from thermal limitations. XEMET micro-filaments used individually or embedded into matrix materials will create new families of products focused on these high-value-added markets. For electronic applications a single XEMET micro-filament 50 microns in diameter is capable of carrying 10 to 20 watts. Embedded into a matrix, they will remove 4 TO 10 times the heat loads limiting wafer scale applications. Formed into MMC's for high temperature advanced materials applications, they will carry in excess of 100 watts each, allowing structural materials to operate in environments which exceed their melting point.

* Information listed above is at the time of submission. *

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