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Award Information
Agency: Department of Commerce
Branch: N/A
Contract: 50-DKNB-1-SB085
Agency Tracking Number: 8.16.06
Amount: $289,568.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 2001
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
8450 Central Avenue, Newark, CA, 94560
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Wahl
 Staff Scientist
 (510) 494-9020
Business Contact
 John Wahl
Title: Principal Investigator
Phone: (510) 494-9020
Research Institution
As flip-chip bonding becomes the predominant standard in the electronics industry, the increased proximity between dice surfaces and packaging materials will require a significant reduction in the latter's alpha particle activity in order to avoid soft errors. Emission rates at or below 0.001 a/cm2/hr are desirable, which is well below the 0.0050 a/cm2/hr capability of today's best detectors. We have developed an active background suppression scheme that dramatically improves the performance of a gas-filled parallel plate chamber, yielding a sensitivity of 0.00017 a/cm2/hr. In Phase 2, we propose to design and build a prototype commercial detector using this scheme to achieve a sensitivity of 0.00005-0.0001 a/cm2/hr. To achieve this goal, we will improve both our background suppression scheme and the instrumentation on the detector. Phase 3 development would then be carried out at XIA to produce a marketable commercial detector.

* Information listed above is at the time of submission. *

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