Manufacturing Assembly Technology for Producing Low-Cost Mini SEMs

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-04-C-R289
Agency Tracking Number: 03SB1-0260
Amount: $749,523.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: SB031-017
Solicitation Number: 2003.1
Small Business Information
ZYVEX CORP.
1321 N. Plano Road, Richardson, TX, 75081
DUNS: 828080288
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Rahul Saini
 MEMS Staff Engineer
 (972) 235-7881
 rsaini@zyvex.com
Business Contact
 Sha-Chelle Manning
Title: Director of Alliances
Phone: (972) 235-7881
Email: shachelle@zyvex.com
Research Institution
N/A
Abstract
This program will provide a key manufacturing breakthrough for high-performance inexpensive miniature SEMs. We plan to develop a MEMS, microassembly-based, fully functional mini-SEM having 1/10,000 the volume of current units. Zyvex is a dynamic small firm with a highly qualified technical team, experienced management, and the advantage of a $25M / 5 year NIST-ATP award that is funding the continued development of the core assembly technology. Our commercialization partner in Phase II, FEI, is one of the leading manufacturers of SEMs and has committed to at least $200K of in-kind support. Zyvex's unique assembly technology combined with FEI's expertise and experience in successfully producing and marketing charged particle microscopes provides us with an excellent opportunity for commercialization. DoD applications include: routine maintenance inspection of helicopter rotors and other critical structural members of military aircraft and vehicles; backpack units to give special forces unique forensic capabilities; and an imaging component of biowarfare agent detection systems to protect both military buildings and war-fighters in the field. Commercial applications include: desktop SEMs for industrial and educational institutions; backpack units for geologists, forensic specialists, etc.; arrayed SEMs for IC inspection; and arrays of columns for maskless high-resolution lithography.

* information listed above is at the time of submission.

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