Defect Mapping of Wafers for Increasing Yield and Operability of Infrared Focal Plane Arrays

Award Information
Agency:
Department of Defense
Amount:
$99,647.00
Program:
SBIR
Contract:
HQ0006-08-C-7812
Solitcitation Year:
2007
Solicitation Number:
2007.3
Branch:
Missile Defense Agency
Award Year:
2008
Phase:
Phase I
Agency Tracking Number:
B073-026-0198
Solicitation Topic Code:
MDA07-026
Small Business Information
AMETHYST RESEARCH, INC.
Southern Oklahoma Technology Center, 2610 Sam Noble Parkway, Ardmore, OK, 73401
Hubzone Owned:
N
Woman Owned:
Y
Socially and Economically Disadvantaged:
Y
Duns:
159048698
Principal Investigator
 Wayne Holland
 Senior Research Scientist
 (405) 227-9414
 admin@amethystresearch.com
Business Contact
 Sallie Reddy
Title: President and CEO
Phone: (405) 227-9414
Email: accounts@amethystresearch.com
Research Institution
N/A
Abstract
The yield and operability of high performance infrared detectors, particularly those based on HgCdTe, are severely compromised by materials defects. Recently, ARI has demonstrated during its UV hydrogenation process that deuterium effectively ‘decorates’ defects in materials such as ZnCdTe and HgCdTe. In essence, the distribution of deuterium in the sample directly ‘maps’ defects in the material. This finding provides a revolutionary tool for materials assessment during HgCdTe FPA processing and production. In particular, when the ‘deuterium decoration’ process is used in conjunction with Nuclear Resonance analysis it will allow for defect ‘maps’ of ZnCdTe substrates, epilayer/buffer ZnCdTe and HgCdTe films to be obtained non-destructively. The impact that this technology, when fully developed, on processing, yield rates, and operability of HgCdTe FPA’s cannot be overstated. In this SBIR Phase I project, ARI will demonstrate a prototype system for wafer mapping for use by the FPA production houses. To this end, ARI has teamed with BAE, Raytheon Vision Systems, Teledyne Imaging Sensors, DRS and Lockheed Martin in order to ensure as rapid a transfer as possible of this manufacturing technology to MDA platforms.

* information listed above is at the time of submission.

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