Nanostructured Poly-DCPD Based Aerogels as Low Cost Thermal and Acoustic Insulation for Aerospace Applications

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$749,185.00
Award Year:
2005
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-05-C-0231
Award Id:
68752
Agency Tracking Number:
03SB2-0524
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
30 Forbes Road Building B, Northborough, MA, 01532
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
012924069
Principal Investigator:
Je Lee
Senior Chemist
(508) 481-5058
jekyun@aerogel.com
Business Contact:
Patrick Piper
CFO
(508) 691-1150
contracts@aerogel.com
Research Institute:
n/a
Abstract
Aspen Aerogels was the first to develop a low-cost, lightweight, nanostructure poly-dicyclopentadiene (poly-DCPD) aerogel material. These materials have low thermal conductivity, low density, minimal particulate shedding and are a low cost material, making them ideally suitable for aerospace and military insulation applications. The proposed Phase II effort will focus on further optimizing the pore structure, physical and mechanical properties, and post-curing conditions of this new class of aerogels to develop a high performance poly-DCPD based aerogel material that will meet specified requirements; including weight and space concerns, thermal performance and durability. The resultant lightweight, highly effective thermal and acoustic insulation will be targeted in the Phase II effort for use in Future Combat Systems' ground vehicle program. Test samples of the final candidate material will be assembled and encapsulated as required for this application. Other applications include structural spacers in fuselage wall cavities and bilge floors of military land, air, and sea vehicles. Thermal, acoustic, and mechanical performance as well as energy absorption capability of the encapsulated coupons will be evaluated to provide data for a design plan/integration path recommendation for Phase III.

* information listed above is at the time of submission.

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