Thermally Insulated Structural Aerogel Composites for Satellite

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-09-C-0155
Agency Tracking Number: 08SB2-0206
Amount: $98,984.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: SB082-008
Solicitation Number: 2008.2
Small Business Information
30 Forbes Road, Building B, Northborough, MA, 01532
DUNS: 012924069
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Je Lee
 Senior Polymer Scientist
 (508) 466-3119
Business Contact
 Kevin Schmidt
Title: VP, Operations
Phone: (508) 691-1161
Research Institution
Multi-Layer Insulation (MLI) is the most commonly used thermal insulation material for spacecraft applications due to its low thermal conductivity in vacuum. However, MLI has several problems including thermal shorts, is labor intensive to fabricate and install and its performance is negatively affected when insulating complex shapes; therefore significant improvements are needed in satellite insulation materials. Aerogel thermal blanket technology has been shown to meet the demanding requirements for space missions with significantly reduced installation time, reduced weight, reduced installed costs, and equivalent thermal performance to state of the art MLI. Aspen now proposes to develop integrated aerogel-based, structural satellite panels, thus eliminating the need for “add-on” insulation, such as MLI. To accomplish this Aspen proposes a dual approach solution that involves aerogel material development in parallel with structural system-level design development to meet the thermal performance requirements of structural satellite panels. Materials development will focus on an aerogel material that is lightweight, with a low thermal conductivity value, is highly durable and reliable over the satellite lifetime. System-level design development will evaluate and trade-off three aerogel-based concepts in order to optimize the panel system design for minimum thermal transfer while maintaining the adequate structural integrity required for satellite applications.

* Information listed above is at the time of submission. *

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