Dynamic Data Transducer Acquisition System

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,998.00
Award Year:
2007
Program:
STTR
Phase:
Phase I
Contract:
N00014-07-M-0383
Agency Tracking Number:
N074-016-0023
Solicitation Year:
2007
Solicitation Topic Code:
N07-T016
Solicitation Number:
n/a
Small Business Information
ETRACIA LLC
111 28TH AVE N, Fargo, ND, 58105
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
603837530
Principal Investigator:
Douglas B.Chrisey
Professor
(518) 276-3303
chrisd@rpi.edu
Business Contact:
Valery Marinov
Manager
(701) 491-1873
valery.marinov@etracia.com
Research Institution:
RENSSELAER POLYTECHNIC INSTITUTE
Wolf W von Maltzahn
110 8th Street
Troy, NY, 12180-3590
(518) 276-4873
Nonprofit college or university
Abstract
The proposed STTR will develop a shock-hardened, autonomous, miniature, wireless multi-channel data acquisition system that is installed in payloads launched from various platforms. The system will be designed to survive impact loads at least ten times higher than those specified in the program solicitation and will also exceed the size and weight constraints for the final design. eTracia has defined a design approach for a Phase I program that will develop and refine the technical concepts based upon our existing hardware and firmware. In particular, the proposed system architecture will incorporate reconfigurable methodologies for the dynamic recognition, characterization, and accommodation of a plethora of sensors. Moreover, our architecture establishes a new design foundation that will allow for self biasing without human intervention. The package design will be based on our proprietary 3-D package (µCube), and will be used in Phase II to manufacture and test a prototype device. The 3-D structure of µCube substantially minimizes the damaging effects of shock loads thus providing an ideal packaging solution for extremely shock-hardened, self-contained microelectronic modules for military and commercial applications. The package design will be supported and the survivability validated by an extensive research effort utilizing the latest developments of the FEA.

* information listed above is at the time of submission.

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