Direct Die Attached CTE Matched Ultra High Thermal Conductivity Graphite/Aluminum Heat Sinks for High RF Power Density Phased Array Radar Systems

Award Information
Agency:
Department of Defense
Amount:
$99,999.00
Program:
SBIR
Contract:
W9113M-08-C-0113
Solitcitation Year:
2007
Solicitation Number:
2007.3
Branch:
Missile Defense Agency
Award Year:
2008
Phase:
Phase I
Agency Tracking Number:
B073-034-0433
Solicitation Topic Code:
MDA07-034
Small Business Information
WMK TECHNOLOGIES, LLC
101 Clematis Avenue, Unit #1, Waltham, MA, 02453
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
809106383
Principal Investigator
 James Cornie
 CTO
 (781) 893-4449
 jcornie@mmccinc.com
Business Contact
 Adam Rosen
Title: CEO
Phone: (215) 375-3035
Email: a.rosen@k-technology.com
Research Institution
N/A
Abstract
A new metal matrix composite material consisting of natural graphite particulates processed into a designed reinforcement architecture that, after pressure infiltration casting with molten Al alloy, results in materials with thermal conductivity (TC) controllable over a range of 600 to 750 W/mK and thermal expansion controllable over the range of 7 to 3 ppm/K. This material, with strategically located high TC “z” inserts is proposed as base plate heat sinks for advanced GaN based phased array radar systems. The material system will be fully characterized. FEA thermal models will be developed for a 4 by 4 channel prototype array which will be manufactured for attachment to T/R module emulators and evaluated by a prime contractor partner for thermal performance. The goal is to enable a two- to three-fold increase in power density in wide bandgap semiconductors and to manufacture radar arrays with greater than 100 channels within essentially a page sized format. The constituent materials are inexpensive. Hence, the proposed technology, at the proper manufacturing scale will provide materials with a cost per unit volume less than copper at 1.5 to 2 times the thermal performance and CTE matching to the T/R module.

* information listed above is at the time of submission.

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