Reduced Emission Magnetic IC (REMIC) Packaging Material
Department of Defense
Missile Defense Agency
Agency Tracking Number:
Solicitation Topic Code:
Small Business Information
POLAR MAGNETICS CORP.
5505 Castle Manor Drive, San Jose, CA, 95129
Socially and Economically Disadvantaged:
AbstractThe need for new IC package system to reduce RF emissions and to enhance thermal conductivity require the developmnet of new materials. These materials are designed from an RF standpoint with additives to reduce thickness and weight while promoting thermaldissipation. A study of the properties of such package mateials is proposed. Devices that require low RF emissions and immunity from RF intereference. Computer systems and comunications systems that must operate in high RFI or EMC enviroments such asfactories that use automatic digitally controlled welding machines.
* information listed above is at the time of submission.