Reduced Emission Magnetic IC (REMIC) Packaging Material

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG6003P0168
Agency Tracking Number: 031-1536
Amount: $69,832.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
5505 Castle Manor Drive, San Jose, CA, 95129
DUNS: 118503080
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Dale Dickinson
 (408) 255-8345
Business Contact
 Gary Bush
Title: CEO
Phone: (405) 255-8345
Research Institution
The need for new IC package system to reduce RF emissions and to enhance thermal conductivity require the developmnet of new materials. These materials are designed from an RF standpoint with additives to reduce thickness and weight while promoting thermaldissipation. A study of the properties of such package mateials is proposed. Devices that require low RF emissions and immunity from RF intereference. Computer systems and comunications systems that must operate in high RFI or EMC enviroments such asfactories that use automatic digitally controlled welding machines.

* information listed above is at the time of submission.

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