Multi-Chip Modules for Hyperspectral Image Processing (MCM-HIP)

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-06-C-0040
Agency Tracking Number: A052-010-2850
Amount: $119,872.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2005
Solicitation Topic Code: A05-010
Solicitation Number: 2005.2
Small Business Information
101 West 6th Street, Suite 200, Austin, TX, 78701
DUNS: 118514855
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David Gibson
 Principal Investigator
 (512) 791-6489
 gibson@coherentlogix.com
Business Contact
 Michael Doerr
Title: CTO
Phone: (512) 791-6489
Email: doerr@coherentlogix.com
Research Institution
N/A
Abstract
Coherent Logix, Incorporated (CLX) proposes to develop a multi-chip module (MCM) system for hyperspectral image processing and other high throughput signal processing applications requiring ultra-low power, extremely-high performance, and a ultra-small form factor. Hyperspectral image processors are currently made by soldering a large number of components onto multiple printed circuit boards resulting in high power, large, heavy systems barely suitable for mounting on automotive vehicles. These systems are too heavy and bulky for a soldier to carry or to mount on micro-UAVs. With the advancement of new revolutionary signal processing technology being developed cooperatively by the US Army, DARPA, and US Air Force, a breakthrough in weight and size reduction may be obtained with multi-chip modules (MCMs) using new interconnection systems and packaging techniques. In the Phase I program, CLX will design several MCMs around its advanced digital signal processor technology. New packaging technologies, including 3-D interconnection and chip stacking will be explored. The different approaches will be compared and trade-offs made based on realistic environmental factors, ruggedization, reliability, and manufacturability. Based on trades, detailed specifications will be developed to facilitate detailed product design, development, and demonstration in Phase 2 of the program.

* Information listed above is at the time of submission. *

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