Multi-Chip Modules for Hyperspectral Image Processing (MCM-HIP)

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$729,914.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
W15QKN-06-C-0219
Award Id:
73841
Agency Tracking Number:
A052-010-2850
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1120 South Capital of Texas Highway, Building 3, Suite 310, Austin, TX, 78746
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
118514855
Principal Investigator:
DavidGibson
Senior MTS
(512) 382-8950
gibson@coherentlogix.com
Business Contact:
MichaelDoerr
Chief Technology Officer
(512) 382-8947
doerr@coherentlogix.com
Research Institute:
n/a
Abstract
Coherent Logix, Incorporated (CLX) proposes to develop a multi-chip module (MCM) for hyperspectral image processing and other high-throughput signal processing applications requiring ultra-low-power, extremely high performance, and very small form factor. Hyperspectral image processors (HIP) are currently made with a large number of integrated circuit (IC) chips and multiple printed circuit boards - resulting in high power, large, heavy systems barely suitable for mounting on automotive vehicles. These systems are too heavy and bulky for a soldier to carry or to mount on UGVs or UAVs. With the advancement of new revolutionary signal processing technology being developed cooperatively by the US Army, DARPA, and US Air Force, a breakthrough in power, size, and weight reduction may be obtained with multi-chip modules (MCMs) using new highly-cabable, low-power ICs. In the Phase I program, CLX compared several approaches to MCM-HIP based around its advanced digital signal processor technology. New packaging technologies, including 3-D interconnection and chip stacking allow future expansion of processor and memory capacity. The different approaches compared in Phase I allow trade-offs based on performance against requirements, ruggedization, reliability, and manufacturability. Based on trades, an MCM will be designed, fabricated, assembled, tested, and demonstrated in Phase II of the program.

* information listed above is at the time of submission.

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