Multi-Chip Modules for Hyperspectral Image Processing (MCM-HIP)

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15QKN-06-C-0219
Agency Tracking Number: A052-010-2850
Amount: $1,607,940.00
Phase: Phase II
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: A05-010
Solicitation Number: 2005.2
Small Business Information
1120 South Capital of Texas Highway, Building 3, Suite 310, Austin, TX, 78746
DUNS: 118514855
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David Gibson
 Senior MTS
 (512) 382-8950
Business Contact
 Michael Doerr
Title: Chief Technology Officer
Phone: (512) 382-8947
Research Institution
Coherent Logix, Incorporated (CLX) proposes to develop a multi-chip module (MCM) for hyperspectral image processing and other high-throughput signal processing applications requiring ultra-low-power, extremely high performance, and very small form factor. Hyperspectral image processors (HIP) are currently made with a large number of integrated circuit (IC) chips and multiple printed circuit boards - resulting in high power, large, heavy systems barely suitable for mounting on automotive vehicles. These systems are too heavy and bulky for a soldier to carry or to mount on UGVs or UAVs. With the advancement of new revolutionary signal processing technology being developed cooperatively by the US Army, DARPA, and US Air Force, a breakthrough in power, size, and weight reduction may be obtained with multi-chip modules (MCMs) using new highly-cabable, low-power ICs. In the Phase I program, CLX compared several approaches to MCM-HIP based around its advanced digital signal processor technology. New packaging technologies, including 3-D interconnection and chip stacking allow future expansion of processor and memory capacity. The different approaches compared in Phase I allow trade-offs based on performance against requirements, ruggedization, reliability, and manufacturability. Based on trades, an MCM will be designed, fabricated, assembled, tested, and demonstrated in Phase II of the program.

* Information listed above is at the time of submission. *

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