Stress and Geometry Imaging from Outside the Pipeline

Award Information
Agency: Department of Transportation
Branch: N/A
Contract: DTRT57-11-C-10025
Agency Tracking Number: 11.1-PH2-002
Amount: $144,921.46
Phase: Phase I
Program: SBIR
Solicitation Topic Code: 111PH1
Solicitation Number: DTRT5711RSBIR1
Timeline
Solicitation Year: 2011
Award Year: 2011
Award Start Date (Proposal Award Date): 2011-06-30
Award End Date (Contract End Date): 2011-12-30
Small Business Information
110-1 Clematis Avenue, Waltham, MA, -
DUNS: 18791827
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Todd Dunford
 Manager, Applied Mechanics
 (781) 642-9666
 jentek@shore.net
Business Contact
 Joni Hatem
Title: Sr. Vice President
Phone: (781) 642-9666
Email: jhatem@primushost.com
Research Institution
N/A
Abstract
There is a well defined, yet unfulfilled need for a convenient (non-contact, light weight) and rapid imaging tool for multi-directional, thru-wall stresses (both applied and residual) from the outside of a pipeline. Quantitative stress imaging is needed at mechanical damage and corrosion sites, as well as at other critical locations (dents, bends, etc.). JENTEK is uniquely positioned to deliver a low cost and reliable solution to this problem that will promote enhanced pipeline safety and vastly improved understanding of residual and applied stress conditions. We have already developed a high resolution, wide bandwidth (i.e., from low to high frequency) impedance measurement method called the MwM-Array, including the many channel electronics and software needed for rapid data acquisition, analysis, and reporting. This Phase I SBIR will demonstrate the feasibility of building databases of relationships between residual/applied stress and multi-directional MWM-Array measured premeability, along with the capability to correct for geometric, cold work/plasticity, and other complexities. This includes the use of very low frequency methods to provide thru wall stress imaging. This program will leverage other DOT and customer funded efforts that are developing field durable electronics and scanners; enabling us to focus on quantitative imaging of stresses.

* Information listed above is at the time of submission. *

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