Flip Chip Bonding Technology Development for Multi-Chip Modules with Superconducting Integrated Circuits

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-09-C-0687
Agency Tracking Number: N074-018-0350
Amount: $747,159.00
Phase: Phase II
Program: STTR
Awards Year: 2009
Solicitation Year: 2007
Solicitation Topic Code: N07-T018
Solicitation Number: 2007.
Small Business Information
175 Clearbrook Road, Elmsford, NY, -
DUNS: 103734869
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Sergey Topygo
 (914) 592-1190
Business Contact
 Edward Kulinski
Title: VP Finance
Phone: (914) 592-1190
Email: ekulinski@hypres.com
Research Institution
 Stony Brook University
 Lydia Chabza
 2540 Dole Street
Hall 402
Honolulu, HI, 96822-
 (631) 632-4849
 Nonprofit college or university
HYPRES in collaboration with Stony Brook University proposes to develop flip-chip bonding technology for assembling up to 4-chip MCMs operating at cryogenic temperatures. This will address the critical area of the MCM technology development and transition to full commercialization of the superconductor MCM technology for DoD and commercial satellite and wireless communications markets. The ultimate goal of this Phase II STTR is to develop a manufacturable process of bonding and assembling multiple superconducting and mixed-technology (hybrid) chips into multi-chip modules with data transfer rates between the chips in excess of 100 Gb/s.

* information listed above is at the time of submission.

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