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Massively Parallel High Temperature Probe System for Wafer-level Reliability Testing

Award Information
Agency: Department of Commerce
Branch: National Institute of Standards and Technology
Contract: SB1341-11-CN-0094
Agency Tracking Number: 103-68-2011
Amount: $300,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code:
Solicitation Number: N/A
Solicitation Year: 2010
Award Year: 2011
Award Start Date (Proposal Award Date): 2011-08-01
Award End Date (Contract End Date): 2014-08-01
Small Business Information
14763 Energy Way
Apple Valley, MN 55124-5762
United States
DUNS: 111765657
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jon  Dunklee
 (503) 505-0247
Business Contact
Research Institution

Historical methods of reliability assessment are less and less effective as device sizes shrink. Larger sample sizes and longer duration tests are increasingly needed. At the same time, efforts to continue scaling semiconductors to ever smaller geometries is leading to an explosion of new device structures, materials and processes. The cost of testing these innovations is becoming a major barrier to their commercialization. The NIST Phase 1 project demonstrated that existing reliability test systems cannot reduce the cost of test significantly for these long duration tests, but concluded that a tightly integrated system offers the potential for a 10-fold reduction in test costs. However, a tightly integrated system introduces risks and unknowns due to the thermal, mechanical and electrical interaction of system components. The objective of this Phase 2 effort is to explore interactions between a broad range of feasible alternative identified in Phase 1 and develop the best possible combination into an integrated system.

* Information listed above is at the time of submission. *

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