High-Temperature, Wirebondless, Ultra-Compact Wide Bandgap Power Semiconductor Modules for Space Power Systems

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,351.00
Award Year:
2011
Program:
SBIR
Phase:
Phase II
Contract:
NNX11CA68C
Award Id:
n/a
Agency Tracking Number:
095450
Solicitation Year:
2009
Solicitation Topic Code:
S3.05
Solicitation Number:
n/a
Small Business Information
FL, Orlando, FL, 32826-2930
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
098250561
Principal Investigator:
JohnElmes
Principal Investigator
(407) 275-1174
jelmes@apecor.com
Business Contact:
JohnElmes
Business Official
(407) 275-1174
jelmes@apecor.com
Research Institute:
Stub




Abstract
Silicon carbide (SiC) and other wide band-gap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultra-high power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high temperature device packaging technology. The objective of this proposed research is to develop a ultra-compact, hybrid power module packaging technology based on the use of double leadframes and direct leadframe-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degrees Celsius. The unique advantages of this innovative solution include very high current carrying capability, low package parasitic impedance, low thermo-mechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and capable of operating from 450C to -125C.

* information listed above is at the time of submission.

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