Polyimide Nanocomposite Circuit Board Materials to Mitigate Internal Electrostatic Discharge

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$100,000.00
Award Year:
2011
Program:
STTR
Phase:
Phase I
Contract:
NNX11CI31P
Agency Tracking Number:
100107
Solicitation Year:
2010
Solicitation Topic Code:
T8.02
Solicitation Number:
n/a
Small Business Information
International Scientific Technologies, Inc.
VA, Dublin, VA, 24084-0757
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
101130032
Principal Investigator:
Russell Churchill
Principal Investigator
(540) 633-1424
intlsci@earthlink.net
Business Contact:
Wanda Gibson
Business Official
(540) 633-1424
intlsci@earthlink.net
Research Institution:
The College of William and Mary
Jane Lopez
P.O. Box 8795
Williamsburg, VA, 23187-8795
() -
Nonprofit college or university
Abstract
In Sub-topic T8.02, NASA has identified a need for improved circuit boards to mitigate the hazards of internal electrostatic discharge (IESD) on missions where high energy electrons may lead to internal electrostatic discharge-based failure. The proposed STTR program will transition polymer technology developed at the Research Institution, the College of William and Mary, to NASA programs and to the private sector through the aegis of the Small Business, International Scientific Technologies, Inc. The program Technical Objectives include evaluation and selection of nanoparticle, organometallic, and metal-ligand additives compatible with polyimide resins to produce electrically conductive circuit boards that reduce the effects of IESD, fabrication of polyimide films incorporating metallic nanostructures to optimize both volume and surface electrical resistivities, and characterization of electrical conductivity, electron beam charging effects, and thermo-mechanical properties of the polyimide resin circuit board materials. The innovation of the Phase I and Phase II programs is the development of polyimide nanocomposite circuit board materials that are resistant to Internal Electrostatic Discharge. The Technology Readiness Level (TRL) is 2 at the beginning of Phase I and 4 or higher at the end of Phase I.

* information listed above is at the time of submission.

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