Damage-Tolerant Integration of Dissimilar Materials Using Microcrack-Resistant Isolating Adhesive

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX11CE06P
Agency Tracking Number: 105963
Amount: $94,930.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: O2.04
Solicitation Number: N/A
Small Business Information
929 South High Street, Suite 188, West Chester, PA, 19382-5466
DUNS: 005704665
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Rita Funchion
 Principal Investigator
 (610) 388-1264
Business Contact
 Rita Funchion
Title: Business Official
Phone: (610) 388-1264
Email: president@appliedanalytic.com
Research Institution
Future space exploration projects will expose system components (such as cryogenic systems) to extreme conditions and to a higher number of pressure and temperature cycles, due to long missions and reusable launch vehicle (RLV) designs. High performance materials, such as low-density ceramics, foams, aerogels, composites, metals, and multi-layer insulations (MLI) will be increasingly used. These materials, however, often have poor mechanical strength and damage-tolerance, and are also difficult to bond to each other, due to the extreme operating temperature and pressure cycles and the mismatch between their thermal (expansion) and mechanical properties. The combination of these drawbacks resulted in the catastrophic detachment of foam insulation from the external tank (ET) in Shuttle Columbia, mission STS-107. There is a need for damage-tolerant, "forgiving" and multifunctional adhesive technologies for integrating dissimilar materials (such as cryogenic pressurized vessels to insulations), and ensuring reliable, integrated lightweight system designs. To address this need, Applied Analytic Research Inc. has designed innovative cost-effective Isolating Adhesives that are multifunctional, Bond, isolate and protect dissmilar adherends in the same time.

* Information listed above is at the time of submission. *

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