The Conductive Thermal Control Material Systems for Space Applications
National Aeronautics and Space Administration
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Small Business Information
Applied Material Systems Engineering, Inc.(AMSENG)
IL, Schaumburg, IL, 60194-3884
Socially and Economically Disadvantaged:
AbstractThis proposal is submitted to develop and demonstrate the feasibility of processing the space environment stable, multifunctional thermal control material system (TCMS) that can be applied to space hardware and can enables the hardware to carry higher leakage current through engineering the high electrical conductivity. An innovative space environmental stable TCMS is suggested through research & development work for the multifunctional, low ( & #945;S/ & #949;T) material systems that can meet these aggressive goals in cost effective, reliable manner. The suggested efforts emphasize developments in two material science areas: the first one considers the development of born nitride nano structure that includes nanotubes and nano mesh (BNNT-BNNM<SUP>TM</SUP>) and the second area proposes the synthesis and processing of various homologous compounds of Zinco-Indates that are recently identified as the high conductivity compounds with high refractive index. The material system that integrates these two technologies can allow higher leakage currents that may also help to defend against the natural solar storm events. The suggested TCMS have been derived from the available mathematical models for space craft charging that pay attention to the individual charge dissipation mechanisms and the molecular dynamics of the material systems as well as its thermodynamics. Thus the envisioned derived material systems can provide the needed reliable TCMS in typical space environments in (LEO), (GEO) & beyond. The reliability goal for the multifunctional conductive TCMS is to have a design life of > 10 years in LEO and > 15 years in GEO, and we anticipate the developments to mature by end of phase II ready for the hardware demonstration.
* information listed above is at the time of submission.