High Resolution, Radiation Tolerant Focal Plane Array for Lunar And Deep Space Applications

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX11CH05P
Agency Tracking Number: 105442
Amount: $99,961.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: S1.09
Solicitation Number: N/A
Small Business Information
Aerius Photonics, LLC
2223 Eastman Avenue, Suite B, Ventura, CA, 93003-8050
DUNS: 145925520
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Lloyd Linder
 Principal Investigator
 (805) 642-4645
 linder@aeriusphotonics.com
Business Contact
 John Baumann
Title: Business Official
Phone: (805) 642-4645
Email: baumann@aeriusphotonics.com
Research Institution
 Stub
Abstract
Aerius Photonics and its partners propose the development of a high resolution, radiation hardened 3-D FLASH Focal Plane Array (FPA), with performance expected to be > 6Mrad total incident dose (TID), and will be able to perform at extremely low temperatures (-230C) without the need for a warm box. This TID performance at cold temperatures is the result of utilizing silicon germanium (SiGe) bipolar technology for the ROIC implementation, and will be the largest SiGe imaging ROIC ever designed and demonstrated. This ROIC will be hybridized with an appropriate selected detector array to produce a FPA of unprecedented TID performance. The TID performance will allow for reduced size, weight, and power (SWaP) for lunar and deep space instruments, thus saving fuel for the mission. The resulting FPA can be utilized in instruments for the Europa-Jupiter System Mission (EJSM), including the near-IR imaging spectrometer, and wide angle, high resolution camera (HRC). It can also be used in flash lidar applications for 3-D mapping to help with hazard avoidance, and for a rover operating during the lunar night in one of the permanently dark polar craters, where optical (passive) cameras could not operate.

* information listed above is at the time of submission.

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