Novel Polishing Process to Fabricate Ultra Low Thickness Variation Diamond Substrates for Next Generation Beam Tracking Detectors

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-11ER90095
Agency Tracking Number: 97837
Amount: $150,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2011
Solicitation Topic Code: 45 b
Solicitation Number: DE-FOA-0000413
Small Business Information
1912 NW 67th Place, Gainesville, FL, -
DUNS: 024935517
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Arul Arjunan
 (352) 334-7237
Business Contact
 Deepika Singh
Title: Dr.
Phone: (352) 334-7237
Research Institution
Diamond crystals with small total thickness variation (TTV) and local thickness variation (LTV) values are needed for position sensitive fast particle detectors for particle tracking/timing, and detecting direct/indirect beams. The fabrication of ultra-flat, low surface defectivity diamond detectors represents a major technological challenge. Although current commercial technology can produce 100m thick, high quality diamond crystals, the current state-of-the-art polishing methods are unable to polish diamond crystals with low thickness variation (typically lesser than few microns). Sinmat has developed a novel reactive chemical mechanical polishing (RCMP) process to polish, planarized, and flatten diamond crystal surfaces that are needed for manufacturing ultra-flat, low surface defectivity diamond detectors. By combining this process with special engineered sample holders, ultra-low TTV and LTV surfaces can be fabricated (with TTV lesser than 1 micron). Commercial Application and Other Benefits: The ability to achieve ultra-flat and defect free diamond crystals will be very beneficial for several applications in the fields of nuclear instrumentation, nuclear radiators, x-ray optics, and next generation electronics. Such devices will help in improving detection systems, instrumentation, and various techniques used in nuclear physics. Such engineered ultra-smooth diamond substrates could also be used for heat dissipation in silicon based electronics

* Information listed above is at the time of submission. *

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