Novel Polishing Process to Fabricate Ultra Low Thickness Variation Diamond Substrates for Next Generation Beam Tracking Detectors

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$150,000.00
Award Year:
2011
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-11ER90095
Award Id:
n/a
Agency Tracking Number:
97837
Solicitation Year:
2011
Solicitation Topic Code:
45 b
Solicitation Number:
DE-FOA-0000413
Small Business Information
1912 NW 67th Place, Gainesville, FL, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
024935517
Principal Investigator:
Arul Arjunan
Dr.
(352) 334-7237
arul@sinmat.com
Business Contact:
Deepika Singh
Dr.
(352) 334-7237
singh@sinmat.com
Research Institution:
Stub




Abstract
Diamond crystals with small total thickness variation (TTV) and local thickness variation (LTV) values are needed for position sensitive fast particle detectors for particle tracking/timing, and detecting direct/indirect beams. The fabrication of ultra-flat, low surface defectivity diamond detectors represents a major technological challenge. Although current commercial technology can produce 100m thick, high quality diamond crystals, the current state-of-the-art polishing methods are unable to polish diamond crystals with low thickness variation (typically lesser than few microns). Sinmat has developed a novel reactive chemical mechanical polishing (RCMP) process to polish, planarized, and flatten diamond crystal surfaces that are needed for manufacturing ultra-flat, low surface defectivity diamond detectors. By combining this process with special engineered sample holders, ultra-low TTV and LTV surfaces can be fabricated (with TTV lesser than 1 micron). Commercial Application and Other Benefits: The ability to achieve ultra-flat and defect free diamond crystals will be very beneficial for several applications in the fields of nuclear instrumentation, nuclear radiators, x-ray optics, and next generation electronics. Such devices will help in improving detection systems, instrumentation, and various techniques used in nuclear physics. Such engineered ultra-smooth diamond substrates could also be used for heat dissipation in silicon based electronics

* information listed above is at the time of submission.

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