Low Defect Density Mercury Cadmium Telluride on Silicon by Bulk Layer Transfer

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-11-C-7671
Agency Tracking Number: B11A-002-0014
Amount: $149,944.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA11-T002
Solicitation Number: 2011.A
Solicitation Year: 2011
Award Year: 2011
Award Start Date (Proposal Award Date): 2011-08-19
Award End Date (Contract End Date): N/A
Small Business Information
DUNS: 609463302
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Vincent Stenger
 Principal Research Engineer
 (614) 799-0664
Business Contact
 Judith Sriram
Title: VP&Business Manager
Phone: (614) 799-0664
Email: judith@srico.com
Research Institution
 Northeastern University
 Lawrence W Barnett
 360 Huntington Avenue
Boston, MA, 02115-5000
 (617) 373-5600
 Nonprofit college or university
Mercury Cadmium Telluride (MCT) has been described as one of the most technologically significant semiconductor materials and is the most widely used material for long wave infrared (LWIR) imaging. The current challenge is to produce MCT over large focal plane array size at low cost and high reliability without compromising sensitivity or noise performance. MCT on silicon substrates is highly attractive for cost and handling reasons and for thermal matching to silicon readout electronics. SRICO proposes to develop wafer bonding and physical layer transfer technology to form bulk quality low defect density (MCT) films on silicon substrates. In Phase I, SRICO will experimentally prove the feasibility of the proposed technology in forming low defect density MCT on silicon substrates. Electrical and optical test structures will be fabricated and tested to qualify the device quality of the material. In a Phase II effort, SRICO would build and test prototype large format focal plane imaging arrays based on the MCT layer transfer technology developed in Phase I.

* Information listed above is at the time of submission. *

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