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Photostructural Glass Ceramics and Optimized Processing for Laser Initiated 3D Conductors (PhotoCon)

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-11-C-0088
Agency Tracking Number: F10B-T11-0321
Amount: $100,000.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: AF10-BT11
Solicitation Number: 2010.B
Timeline
Solicitation Year: 2010
Award Year: 2011
Award Start Date (Proposal Award Date): 2011-08-19
Award End Date (Contract End Date): N/A
Small Business Information
4531 Dulcinea Ct
Woodland Hills, CA -
United States
DUNS: 796034747
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 William Morey
 Chief Scientist
 (310) 567-6735
 obalon@gmail.com
Business Contact
 Ruslan Gadulshin
Title: Director of Business Development
Phone: (818) 262-7746
Email: obalon@gmail.com
Research Institution
 Aerospace Corporation
 Henry Helvajian
 
2310 East El Segundo Boulevard
El Segundo, CA 90245-
United States

 (310) 336-7621
 Federally Funded R&D Center (FFRDC)
Abstract

ABSTRACT: In this STTR effort a small business company Obalon LLC is teaming up with industry leader Aerospace Corporation in order to develop novel photostructural glass ceramic composition PhotoCon with capability of laser induced 3D conductor patterning inside the bulk material. Following the photolytic process of laser exposure and the development of latent image the team will implement the series of novel processing steps that would enable conglomeration of metal around the initially exposed areas until the desired RF and DC conductivity of the patterned 3D structure is achieved. In Phase I effort through the theoretical analysis and the experimental testing we will identify the glass ceramic composition requirements that would enable the metal conductor formation inside the bulk material. We will also optimize the processing steps for efficient conductor patterning. In Phase II we will produce liter size material samples and fully characterize the resulting material for both the photo initiated conductor formation and dimensional patterning using chemical etching process. The path towards high temperature sensor fabrication will be established and high temperature resistant glass ceramic structures will be produced. BENEFIT: Novel glass ceramics with the ability to fabricate 3D conductors in bulk material using automated laser writing will find a number of applications in consumer electronics including touch screen displays, portable antennas and interconnects for processor chips. The capability of precise glass ceramic patterning with the ability to wire desired elements will enable the next generation 3D circuit boards. The electrode formation in combination with etched micro fluidic channel fabrication opens up a wide variety of biomedical sensor applications for both the massive low cost parallel sample processing such as DNA sequencing and the specific micro analytical probes for point of care testing. The novel high temperature glass ceramic sensors and RF components will increase the reliability and improve the manufacturability of system designs in aerospace industry.

* Information listed above is at the time of submission. *

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