Full Spectrum Zinc Oxide Nanowire Sensors By MOCVD

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$500,000.00
Award Year:
2011
Program:
STTR
Phase:
Phase II
Contract:
N68335-11-C-0040
Award Id:
n/a
Agency Tracking Number:
N09A-004-0710
Solicitation Year:
2009
Solicitation Topic Code:
N09-T004
Solicitation Number:
2009.A
Small Business Information
201 Circle Drive North, Unit # 102, Piscataway, NJ, 08854-
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
787144807
Principal Investigator:
Bruce Willner
Senior Engineer
(732) 302-9274
bwillner@structuredmaterials.com
Business Contact:
Gary Tompa
President
(732) 302-9274
gstompa@structuredmaterials.com
Research Institution:
Drexel University
Jonathan Spanier
3201 Arch Street, Suite 100
Philadelphia, PA, 19104-2875
(215) 255-2301
Nonprofit college or university
Abstract
Structured Materials Industries, Inc. (SMI) with its partner, Drexel University, propose to build upon our Phase I success and continue the development of electrically contacted zinc oxide nanowire (NW) arrays for highly efficient solar blind UV sensors, and implement them in a packaged prototype product. The properties of ZnO make it a very promising material for optoelectronic devices. In particular, the wide bandgap (3.37eV) and large exciton binding energy (60meV), and the ability to fabricate stable, uniform ZnO nanowires make the material attractive as a sensor material. A ZnO nanowire focal plane array has great potential as a highly sensitive, low noise imager capable of operation over a broad wavelength range. The wide bandgap of ZnO will produce very little thermal noise. A dense array of nanowires, properly designed, will produce a very large absorption cross section for the design wavelength range. The precise control of nanowire deposition, including composition and diameter provides the ability to adapt the structures for particular objectives. Further, sensitizers (molecular or nanoparticle) on the surface of the nanowires may be used to tune the optoelectronic response further. The unique material system allows fabrication processes compatible with silicon IC technology, providing high quality, low-cost devices.

* information listed above is at the time of submission.

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