Direct-to-Metal Bonding for Improved Thermal Performance of Lasers

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-11-C-7585
Agency Tracking Number: B103-006-0058
Amount: $99,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: MDA10-006
Solicitation Number: 2010.3
Small Business Information
Precision Photonics Corporation
3180 Sterling Circle, Boulder, CO, -
DUNS: 112617480
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Asher Woolverton
 Senior Scientist
 (303) 952-2902
Business Contact
 Ruth McCurry
Title: Controller
Phone: (303) 952-2901
Research Institution
The most promising and scalable high-power laser geometries effectively manage thermal transfer from the laser crystal to the heat sink. While next generation crystals and pump geometries aim to eliminate waste heat in the first place, it will always be the case that efficient removal of heat will be paramount for further power scaling. When powers reach the kilowatt level, in an area about the size of a penny, heat removal is the roadblock. Soldering represents the current state-of-the-art, but still has relatively low thermal conductivity and challenges with matching thermal expansions. Various thermal compromises occur, even for the best currently-available thermal attachment methods. Precision Photonics Corporation has recently demonstrated a process Direct-to-Metal Bonding that can replace soldering or gluing as the thermal attachment method for certain high-power lasers, and enables higher thermal conductivity interfaces for many other applications, also. This Phase 1 effort will provide detailed characterization of that process, and validate functional laser devices using this thermal attachment method via measurement of thermo-optic aberrations.

* information listed above is at the time of submission.

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