High Flux Cooling System for Solid State Lasers

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-11-C-7562
Agency Tracking Number: B103-006-0404
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: MDA10-006
Solicitation Number: 2010.3
Small Business Information
NJ, Whippany, NJ, 07981-1423
DUNS: 015334899
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Thomas Walter
 Principal Engineer
 (518) 320-8552
Business Contact
 Karen Rizzi
Title: General Manager
Phone: (973) 326-9920
Email: ksr@mechsol.com
Research Institution
Solid State Lasers, high power microwaves and other future Directed Energy Weapons (DEWs) are notoriously inefficient, typically converting 20 percent or less of their input energy to useful output, with the remainder requiring removal in the form of heat. In most cases, the devices must be paused while the waste heat is removed. Weapon unavailability is the war fighter"s nemesis. Also perplexing: Today"s heat removal systems are bulky/heavy, and for high power systems, consume trailers full of equipment. These limitations hinder DEW development and battlefield acceptance. Mechanical Solutions, Inc. proposes a game-changing reduction in cooling system weight and size perhaps 100 to 1 or more. Key innovations: A) Refinement and application of an advanced method for transferring waste heat from the laser diodes to a commercially available and commonly used refrigerant; B) A refrigerant vapor compressor that combines several innovative technologies, resulting in a miniaturized device with performance far superior to alternative compression methods. Successful development will enable higher power, more compact, lighter devices. The direct result will be wider DEW use, including those on smaller, more efficient transporters that can be rapidly deployed into more situations, so that these devices can become an increasing part of our nation"s defense.

* Information listed above is at the time of submission. *

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