Innovative Sensor Packaging and Testing

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-11-C-7502
Agency Tracking Number: B103-024-0390
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: MDA10-024
Solicitation Number: 2010.3
Small Business Information
6767 Old Madison Pike, Suite 410, Huntsville, AL, -
DUNS: 36-352-69
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Stephen Granade
 Principal Investigator
 (256) 971-0036
 granade@aos-inc.com
Business Contact
 Kristina Parmenter
Title: Business Manager
Phone: (256) 971-0036
Email: contracts@aos-inc.com
Research Institution
 Stub
Abstract
Infrared optical systems are advancing rapidly. Infrared Focal Plane Arrays (FPAs) have grown from small single color scanning detectors to large two-color detector arrays. New materials and processes are improving IR system performance. But the transition from promising laboratory-based technology to fielded system is slow, due in large part to the low Technology Readiness Level (TRL) of the technologies. Often the transition is further hampered by a lack of standardized testbeds that could provide a way to quickly evaluate new technologies and move them into the field. To address this need, AOS proposes to establish a testbed using an existing modular design for an infrared dewar system as the core IR sensor hardware test platform, an FPGA-based sensor processor, and a computer-based test control console. AOS"s Modular Integrated Dewar Assembly (MIDA) has been manufactured as part of a previous SBIR project and the system is available to serve as the universal test set that will allow devices under test to be incorporated rapidly. Key to this testbed is our development of modular interfaces that use kinematic self-alignment techniques to provide repeatable zero-alignment interfaces. By implementing interfaces that comply with deterministic and repeatable component alignment standards, the MIDA allows parts to be easily interchanged with no significant redesign cost. Figure 1 shows the concept.

* Information listed above is at the time of submission. *

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