High Compliance Carbon Nanotube based Thermal Interface Material for Space Applications

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$99,929.00
Award Year:
2011
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-11-M-0084
Award Id:
n/a
Agency Tracking Number:
F103-086-1242
Solicitation Year:
2010
Solicitation Topic Code:
AF103-086
Solicitation Number:
2010.3
Small Business Information
2600 Campus Drive, Suite D, Lafayette, CO, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
Y
Duns:
161234687
Principal Investigator:
JohnCronin
Senior Engineer
(303) 664-0394
john.cronin@ctd-materials.com
Business Contact:
LoriBass
Sr. Finance and Contracts Manager
(303) 664-0394
lori.bass@ctd-materials.com
Research Institute:
Stub




Abstract
ABSTRACT: The U.S. Air Force is seeking high-thermal conductivity gaskets to improve the thermal efficiency of space-based electronic systems. Advanced gasket materials will enhance the performance of electronic packages by improving heat dissipation during operation. Moreover, thermal management systems are often large, relatively heavy components that add volume and weight to the spacecraft. To address the need for improved thermal interface materials (TIM), Carbon Nanotube (CNT) Array-based TIM"s will be developed. These materials will be lightweight, highly compliant, reworkable, and highly thermally conductive. In addition, the CNT-based TIM"s will significantly reduce assembly, integration, and test time (AI & T) for the spacecraft. BENEFIT: With increased thermal capacity, as well as lighter weight and smaller packaging, thermal gaskets with carbon nanotube array could revolutionize the thermal management systems used in microprocessors, telecommunication systems, and power supplies. Heat dissipation is often a limiting factor in the performance of these systems, and the use of interface materials with significantly higher thermal conductivities will enable the construction of smaller and lighter systems, while also reducing power consumption. The results will be improved operational performance and longer lifetimes in the electronic components.

* information listed above is at the time of submission.

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