Easily Reworkable Thermal Interface Material for Space Applications

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,925.00
Award Year:
2011
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-11-M-0085
Agency Tracking Number:
F103-086-2105
Solicitation Year:
2010
Solicitation Topic Code:
AF103-086
Solicitation Number:
2010.3
Small Business Information
NanoTechLabs Inc.
409 W. Maple St., Yadkinville, NC, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
041336913
Principal Investigator:
Thomas Tiano
Principal Investigator
(978) 846-0377
ttiano@nanotechlabs.com
Business Contact:
Richard Czerw
CEO
(336) 403-7762
czerwr@nanotechlabs.com
Research Institution:
Stub




Abstract
ABSTRACT: In this program, the NanoTechLabs team will develop an easily-reworkable thermal interface material (TIM) that is highly thermally conductive, easy to handle, and highly compliant, yet can be qualified for aerospace and space missions. The enabling technology is the combination of a highly-compliant silicone-based pressure sensitive adhesive (PSA) in combination with trimodal micro-and nanoscale silver that allows the PSA to have a consistent and bond line, low contact resistance and low thermal resistance. Use of a PSA allows easy application of the TIM from a roll of material with a release film. It also reduces the time and damage associated with rework as the PSA can be removed via mechanical and/or solvent techniques. The PSA will be available in a tape that can be applied directly to the substrate for a highly controlled bond thickness. It will have an extremely long working time, but will be easily applied and reworked. NTL will test this material for thermal and mechanical properties as well as outgassing. BENEFIT: The benefits of this system include high thermal conductivity, easy application and it is readily reworked. Beyond space applications, this TIM will find applications as a thermal management material in military and commercial microelectronics as well as applications in medical devices.

* information listed above is at the time of submission.

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