You are here
Ceramic Field Repair for Structurally Compliant, Dielectric Matched Component Restoration
Title: Dir. Fiber Manufacturing
Phone: (818) 991-8500
Email: chris@matechgsm.com
Title: Chairman&CEO
Phone: (818) 991-8500
Email: ed@matechgsm.com
ABSTRACT: In this AF Phase I SBIR program, MATECH proposes to demonstrate the ability to perform"on wing"repair of ceramic matrix composite (CMC) components. Due to safety concerns (both for aircraft and personnel), on wing repairs cannot exceed 300F cure temperatures. In addition, the presence of organic solvents is highly undesirable due to both fire safety and toxicity. MATECH proposes to demonstrate its high ceramic yield, fully domestic, solvent less preceramic polymer resin, developed for its successful SiNC and SiC ceramic fiber programs, as the preferred resin system for field repair. This resin can be fully cured at below 300F, thereby meeting the on wing temperature requirement. This resin also emits limited gaseous by-products during curing. Higher temperature"pyrolysis"can be performed either by utilizing engine heat (for engine and/or engine exhaust components) or in flight (for leading edge components). In the Phase I, MATECH will demonstrate this approach by measuring CMC strength before and after the simulated repair. The technique used for the simulated repair will be amenable to an operational field application environment (flight line or hanger). This Phase I program benefits from the active support and participation of Lockheed Martin Co., Pratt & Whitney, General Atomics. BENEFIT: Ceramic and ceramic matrix composite will be increasingly utilized in both military and commercial aircraft engines and turbine generators, along with other applications requiring high service temperature components, due to their light weight and higher service temperature capabilities. A facile, user friendly ceramic repair capability would greatly encourage the use of ceramics and CMCs in commercial applications by reducing maintenance costs.
* Information listed above is at the time of submission. *