Compact Thermoelectric-based Pre-Cooling Assembly for the E-2D Liquid Cooling System

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-11-C-0021
Agency Tracking Number: N102-114-1324
Amount: $79,911.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: N102-114
Solicitation Number: 2010.2
Small Business Information
200 Yellow Place, Pines Industrial Center, Rockledge, FL, -
DUNS: 175302579
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Michael Cutbirth
 (321) 631-3550
Business Contact
 Michael Rizzo
Title: Chief Financial Officer
Phone: (321) 631-3550
Research Institution
A 5 degree farenheit decrease in cooling temperature within the E-2D Liquid Cooling System (LCS) would translate to an additional 15 kW capacity to remove electronic waste heat. For this, thermoelectric cooling represents a compact, minimally intrusive method for achieving the desired augmentation while meeting all system constraints. However, a major disadvantage to thermoelectric cooling is the energy penalty associated, with a coefficient of performance (COP) on the order of 0.5 typical, compared to vapor-compression refrigeration cycles with COP of 3 typical. For thermoelectric cooling, the COP is directly dependent upon the packaging of the thermoelectric modules and the overall thermal resistance between the heat source and heat sink. For the E-2D LCS, Mainstream has designed a pre-cooler assembly utilizing commercial-off-the-shelf thermoelectric coolers and advanced heat exchanger designs to yield 5 aF of pre-cooling during ground operations and 8 degree farenheit of pre-cooling during flight operations with an overall COP of 0.6 and 0.9, respectively. Due to Mainstreams extensive history with custom heat exchanger designs, the Phase I effort will focus on fabrication and demonstration of the pre-cooler at a 1:13 scale. The Phase II effort will result in full-scale demonstration units for field-testing.

* Information listed above is at the time of submission. *

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