Thermal Management of Highly Integrated Radio Frequency (RF) Electronics

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-11-C-0310
Agency Tracking Number: N111-023-0112
Amount: $79,581.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2011
Solicitation Topic Code: N111-023
Solicitation Number: 2011.1
Small Business Information
650 Suffolk Street, Suite410, Lowell, MA, -
DUNS: 168849011
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Muir
 principal engineer
 (978) 441-1117
 jmuir@aurigamicrowave.com
Business Contact
 Yuysuke Tajima
Title: Chief Technology Officier
Phone: (978) 441-1117
Email: ytajima@aurigamicrowave.com
Research Institution
 Stub
Abstract
Modern RF electronics such as those used in airborne active electronically scanned array (AESA) based radar systems employ high-power density, high-temperature electronic devices requiring advanced thermal management technology. For optimal operation, these devices, in particular the transmit/receive (T/R) modules in an array, need to efficiently dissipate significant quantities of heat and maintain accurate temperature control across the array. Auriga Measurement Systems (Auriga) has been developing a solution to these thermal issues that utilizes a new approach to the chip and module design. We will develop a plan to reduce the heat generation both at the module level and power distribution in the array. This includes efficiency improvement of the gallium nitride (GaN) PA, maximizing array efficiency by power tapering, reduction of power dissipation in the LNA and reducing power losses by adopting a distributed power supply system. Overall goal of the effort is to reduce the heat generation in the module and power distribution by a factor of 2. These concepts and designs will be demonstrated as proof of concept prototypes in Phase I and Phase I Option. We will develop a full-scale development and assessment plan on an array concept identified by the Navy.

* Information listed above is at the time of submission. *

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