Development of a high performance, cost effective GaN power amplifier packaging for transmit/receive modules

The basic building block for phased array radar systems is based on a transmit/receive module containing MMICs for control and amplification of both transmit and receive paths. The cost, performance, and reliability of these modules have been plagued due to limitations in power amplifier packaging designs. Currently, a cavity-mount approach is utilized that minimizes parasitics and reduces thermal resistance from the power amplifier to cold plate using a heat spreader insert. However, the materials and attach methods involved in this package are costly and limit the performance of each power amplifier. In this proposal, APEI, Inc. will leverage its previous research expertise to develop a high performance GaN power amplifier package consisting of low cost heat spreader and die attach materials. In addition, a new packaging scheme is proposed that can potentially reduce the junction temperature by one-third compared to current packaging techniques.