A Conformal Packaging and Installation Technique for In Situ Sensors in Extreme Environments

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-11-C-0508
Agency Tracking Number: N112-123-0584
Amount: $79,992.00
Phase: Phase I
Program: SBIR
Awards Year: 2011
Solicitation Year: 2011
Solicitation Topic Code: N112-123
Solicitation Number: 2011.2
Small Business Information
Sporian Microsystems, Inc.
515 Courtney Way Suite B, Lafayette, CO, -
DUNS: 128688111
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Yiping Liu
 Senior Materials Scientis
 (303) 516-9075
Business Contact
 Michael Usrey
Title: VP of Business Developmen
Phone: (303) 516-9075
Email: musrey@sporian.com
Research Institution
Sporian Microsystems Inc. has spent the last several years developing polymer derived SiCN sensor and associated packaging technology for application temperatures up to 1350degreesC, and demonstrated them in the combustion environments of a range of commercial burner rigs and aerospace turbine engines. Based on our expertise in high temperature materials and packaging processes, we propose to develop a conformal packaging and"stick on"installation strategy for high temperature conformal sensors. Phase I will primarily include fabrication of conformal substrates, evaluation of thick film metallization, die attach, high temperature electrical interconnection, coating/encapsulation, and identification of advanced installation approaches. Simple proof of principle packaging prototypes will be installed on conformal surfaces and key aspects of the performance up to 600 degrees C will be demonstrated. The ultimate goal of this proposed effort is to develop a genetic/standardized high temperature conformal packaging and installation technology for use in extreme aerospace environments, at temperatures ranging from -60degreesC up to 1000degreesC, and accelerations levels up to 56600g. Such packaging should be easily installed with no permanent changes to the engine components or surfaces, and sufficiently small and conformal to avoid disrupting aerodynamic flows. The packaging should be widely adaptable for many conformal sensor technologies with future development effort.

* information listed above is at the time of submission.

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