Non-Contact Sensor Technology to Locate Electromagnetic Grids in Ceramics

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$69,958.00
Award Year:
2011
Program:
SBIR
Phase:
Phase I
Contract:
W31P4Q-11-C-0193
Agency Tracking Number:
A103-151-0458
Solicitation Year:
2010
Solicitation Topic Code:
A10-151
Solicitation Number:
2010.3
Small Business Information
Resodyn Corporation
130 North Main Street, Suite 600, Butte, MT, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
836287680
Principal Investigator:
Stephen Galbraith
Principal Investigator
(406) 497-5223
sgalbraith@resodyn.com
Business Contact:
Lawrence Farrar
President
(406) 497-5252
LCFarrar@resodyn.com
Research Institution:
Stub




Abstract
Electromagnetic structures buried in optical ceramic domes may be accurately located using an electromagnetic sensor and detection technology. A preliminary experiment demonstrated this claim but an investigation into electromagnetic properties that can vary as a result of manufacturing tolerance is required. Similar off-the-shelf technologies will be prone to error caused by these property variations. Competing technologies such as capacitive, optical, or sonic lack a key advantage the electromagnetic approach offers - optical ceramic, cutting fluids, dust, and surface conditions are electromagnetically transparent. This makes it possible to develop a small, light weight sensor that can integrate to a standard coordinate measuring machine or directly to a ceramic grinding and polishing machine. In a manufacturing environment, the sensing technology could be used to tell the grinding and polishing machine, real-time, where to locate dome surfaces. Resodyn Corporation proposes a Phase I study to quantify electromagnetic property variations on test specimens manufactured to tolerance limits. Using existing Resodyn Corporation technology and know-how a custom sensor will be fabricated for the study and compensation methods will be formulated.

* information listed above is at the time of submission.

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