Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-11-C-0273
Agency Tracking Number: N2-3472
Amount: $300,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2011
Solicitation Year: 2008
Solicitation Topic Code: OSD08-M01
Solicitation Number: 2008.3
Small Business Information
5110 Roanoke Place, Suite 101, College Park, MD, -
DUNS: 181660775
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Joelle Arnold
 Member of the Technical S
 (301) 474-0607
Business Contact
 Craig Hillman
Title: CEO
Phone: (301) 474-0607
Research Institution
This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs (ball count), and test methodologies will be examined to fully characterize this process. For the military, this is an excellent interim approach prior to wholesale adoption of Pb-free parts and processes. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.

* Information listed above is at the time of submission. *

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