Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$300,000.00
Award Year:
2011
Program:
SBIR
Phase:
Phase II
Contract:
N68335-11-C-0273
Agency Tracking Number:
N2-3472
Solicitation Year:
2008
Solicitation Topic Code:
OSD08-M01
Solicitation Number:
2008.3
Small Business Information
DfR Solutions
5110 Roanoke Place, Suite 101, College Park, MD, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
181660775
Principal Investigator:
Joelle Arnold
Member of the Technical S
(301) 474-0607
jarnold@dfrsolutions.com
Business Contact:
Craig Hillman
CEO
(301) 474-0607
chillman@dfrsolutions.com
Research Institution:
Stub




Abstract
This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs (ball count), and test methodologies will be examined to fully characterize this process. For the military, this is an excellent interim approach prior to wholesale adoption of Pb-free parts and processes. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.

* information listed above is at the time of submission.

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