High-Speed Surface Measurement Device

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$729,963.00
Award Year:
2011
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-11-C-0022
Award Id:
n/a
Agency Tracking Number:
A2-4246
Solicitation Year:
2009
Solicitation Topic Code:
A09-003
Solicitation Number:
2009.1
Small Business Information
2905 Westcorp Blvd., Suite # 220, Huntsville, AL, -
Hubzone Owned:
Y
Minority Owned:
Y
Woman Owned:
Y
Duns:
868299129
Principal Investigator:
Georges Nehmetallah
Senior Engineer
(256) 536-4346
nehmetgt@notes.udayton.edu
Business Contact:
Sarat Praharaj
Vice President
(256) 536-4346
spraharaj@aol.com
Research Institute:
Stub




Abstract
We propose to follow our successul Phase I development of dynamic holographic interferometry methods with work extending both DIGHI and RADHI approaches to accurately image surfaces traveling up to Mach 5. We will develop a measurement device that will be used to record high-speed holographic images of surface deformations. This work will culminate in an instrument and software capable of capturing deformations on a nanosecond time scale. A pulsed laser will allow capturing holographic images of deformations with 50 nanosecond exposures and delay of 1 microsecond between pre-event and post-event images. Our software development allows automated post-processing of data for rapid visualization and analysis. We will incorporate multi-wavelength illumination to facilitate scaling of DIGHI measurements to allow holographic imaging of deformations on the order of tens to hundreds of microns. We will further develop models for the RADHI techniques to enable accurate prediction of deformation maps from dynamic recordings of holograms. Finally, hydrocodes such as LS-DYNA will be validated against these measurements. At the end of Phase II the hardware and software developed will be combined to create an off-the-shelf instrument package for use in test facilities as well as industries requiring nanometer- and micron-scale real-time surface measurement instrumentation

* information listed above is at the time of submission.

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