MMIC EMI Passivation Coating

Award Information
Agency:
Department of Defense
Amount:
$299,964.00
Program:
SBIR
Contract:
N00024-11-C-4155
Solitcitation Year:
2009
Solicitation Number:
2009.3
Branch:
Navy
Award Year:
2011
Phase:
Phase II
Agency Tracking Number:
N093-212-0392
Solicitation Topic Code:
N093-212
Small Business Information
Nuvotronics LLC
7586 Old Peppers Ferry Loop, Radford, VA, -
Hubzone Owned:
Y
Woman Owned:
Y
Socially and Economically Disadvantaged:
N
Duns:
827121455
Principal Investigator
 David Sherrer
 President
 (800) 341-2333
 dsherrer@nuvotronics.com
Business Contact
 Scott Meller
Title: Vice President
Phone: (800) 341-2333
Email: contracts@nuvotronics.com
Research Institution
 Stub
Abstract
Microwave and mm-wave modules often leverage a combination of MMIC die, discrete devices, circuits on ceramics, and bond wires assembled into a metal housing that typically contains a series of connectors. While modern microelectronics has largely done away with hermetic packaging, many microwave modules still use hermetic lids to seal the enclosures, providing the dual function of protecting the circuits from environmental damage and blocking EMI to and from the circuit. This packaging approach incurs a significant cost penalty to the device, but the sensitivity of microwave circuit components to their local environment has prevented the use of more common, less expensive potting and plastic encapsulation solutions because it changes the behavior of the underlying circuit and can cause significant variation over time and temperature. During Phase I, Nuvotronics investigated several promising material solutions for MMIC packaging that provide protection from the environment and EMI shielding. During the Phase II project, Nuvotronics and its development team will refine novel material coating approaches developed in the Phase I project, and transition the optimum solution to MMIC suppliers for DOD applications.

* information listed above is at the time of submission.

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