Small Pitch Flip-Chip Interconnects for Focal Plan Arrays/Readout Integrated Circuit Hybridization

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$729,944.00
Award Year:
2011
Program:
SBIR
Phase:
Phase II
Contract:
W909MY-11-C-0019
Agency Tracking Number:
A2-4428
Solicitation Year:
2009
Solicitation Topic Code:
A09-084
Solicitation Number:
2009.2
Small Business Information
EPIR Technologies Inc
590 Territorial Drive, Suite B, Suite B, Bolingbrook, IL, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
068568588
Principal Investigator:
Pete Dreiske
Senior Director
(630) 771-0203
pdreiske@epir.com
Business Contact:
Sivalingam Sivananthan
CEO
(630) 771-0201
ssivananthan@epir.com
Research Institution:
Stub




Abstract
Infrared night vision is a key technology employed by the U.S. military for multiple critical applications. The cameras utilize detector pixel arrays (often composed of HgCdTe) hybridized to silicon read out circuitry. For next generation applications, the goal is to reduce pixel pitch and increase the number of pixels in the chip to improve image resolution and increase the instantaneous area that may be imaged. While indium bump to indium bump hybridization has been successfully employed to date, it becomes increasingly difficult to fabricate the interconnects as the pitch decreases. The new hybridization approach proposed herein will achieve smaller pitch when compared to the current state of the art. The proposed EPIR approach addresses the key limiters in the current technology through improved management of the lateral spread of the mated indium bumps during hybridization, while still accommodating the non-planarity and non-parallelism between the parts to be hybridized. Existing processing methods which are capable of smaller pitch will be employed, without the need for major re-tooling; the functionality of the structure to make good electrical contact over large areas is maintained while the inherent pitch capability is improved.

* information listed above is at the time of submission.

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