Small Pitch Flip-Chip Interconnects for Focal Plan Arrays/Readout Integrated Circuit Hybridization

Award Information
Agency:
Department of Defense
Amount:
$729,944.00
Program:
SBIR
Contract:
W909MY-11-C-0019
Solitcitation Year:
2009
Solicitation Number:
2009.2
Branch:
Army
Award Year:
2011
Phase:
Phase II
Agency Tracking Number:
A2-4428
Solicitation Topic Code:
A09-084
Small Business Information
EPIR Technologies Inc
590 Territorial Drive, Suite B, Suite B, Bolingbrook, IL, -
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
068568588
Principal Investigator
 Pete Dreiske
 Senior Director
 (630) 771-0203
 pdreiske@epir.com
Business Contact
 Sivalingam Sivananthan
Title: CEO
Phone: (630) 771-0201
Email: ssivananthan@epir.com
Research Institution
 Stub
Abstract
Infrared night vision is a key technology employed by the U.S. military for multiple critical applications. The cameras utilize detector pixel arrays (often composed of HgCdTe) hybridized to silicon read out circuitry. For next generation applications, the goal is to reduce pixel pitch and increase the number of pixels in the chip to improve image resolution and increase the instantaneous area that may be imaged. While indium bump to indium bump hybridization has been successfully employed to date, it becomes increasingly difficult to fabricate the interconnects as the pitch decreases. The new hybridization approach proposed herein will achieve smaller pitch when compared to the current state of the art. The proposed EPIR approach addresses the key limiters in the current technology through improved management of the lateral spread of the mated indium bumps during hybridization, while still accommodating the non-planarity and non-parallelism between the parts to be hybridized. Existing processing methods which are capable of smaller pitch will be employed, without the need for major re-tooling; the functionality of the structure to make good electrical contact over large areas is maintained while the inherent pitch capability is improved.

* information listed above is at the time of submission.

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