Indium Surface Preparation for Improved Flip-Chip Hybridization

Award Information
Agency: Department of Defense
Branch: Army
Contract: W909MY-11-C-0067
Agency Tracking Number: A2-4649
Amount: $727,272.00
Phase: Phase II
Program: SBIR
Awards Year: 2011
Solicitation Year: 2010
Solicitation Topic Code: A10-017
Solicitation Number: 2010.1
Small Business Information
4459 White Bear Parkway, White Bear Lake, MN, -
DUNS: 156974024
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Greg Wagner
 (651) 789-9000
Business Contact
 Judy Dugas
Title: CFO
Phone: (651) 789-9000
Research Institution
The purpose of this SBIR research is to develop an Indium Oxide (InOx) inhibitor coating for applications to high performing Large Format and High Definition FPAs with a fast hybridization cycle time and high yield. The primary constraint for this method of hybridization is an Indium Oxide layer present on the surface of the Indium bumps at elevated temperatures. The Indium Oxide layer, at the scales and form factors of future FPA products, effectively packages the pure Indium and prevents free form reflow of the Indium bump. This restricts the effectiveness and capability of the FPA and ROIC bond process. The technology being developed in this SBIR will solve this fundamental material limitation. A solution to this fundamental material property is required to advance state of the art FPA technology.

* Information listed above is at the time of submission. *

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