Dual S&C-Band Telemetry Transmitter System for Missile Testing

Award Information
Agency:
Department of Defense
Amount:
$100,000.00
Program:
STTR
Contract:
HQ0147-12-C-7085
Solitcitation Year:
2011
Solicitation Number:
2011.B
Branch:
Missile Defense Agency
Award Year:
2012
Phase:
Phase I
Agency Tracking Number:
B11B-004-0014
Solicitation Topic Code:
MDA11-T004
Small Business Information
Intelligent Automation, Inc.
15400 Calhoun Drive, Suite 400, Rockville, MD, -
Hubzone Owned:
N
Woman Owned:
Y
Socially and Economically Disadvantaged:
N
Duns:
161911532
Principal Investigator
 Wendy Nicholas
 Lead Electrical Engineer
 (301) 294-5273
 wnicholas@i-a-i.com
Business Contact
 Mark James
Title: Director, Contract&Proposal
Phone: (301) 294-5221
Email: mjames@i-a-i.com
Research Institution
 Purdue University
 Dimitrios Peroulis
 Birck Nanotechnology Center
1205 West State Street
West Lafayette, IN, 47907-2057
 (765) 494-3491
 Nonprofit college or university
Abstract
IAI proposes the design of a Waveform Agile Telemetry Transmitter (WATT) which will support simultaneous dual-band S-C band operation (S-band , 2200-2400 MHz and C-band selectable between 4400-4950 MHz and 5091- 5250 MHz), to achieve the goals of this solicitation. Our proposed WATT architecture will employ state of the art, highly integrated, wideband Monolithic Microwave Integrated Circuits (MMIC) and reconfigurable digital processor to achieve desired miniaturization and multi-band capability. Low power, wideband Phase Lock Loops (PLL) and I-Q modulators will manage the dual band RF up-conversion. IAI has teamed up with Purdue University (PU) for the proposed STTR program. PU will develop the wideband RF power combiner and power amplifier (PA) that will simultaneously work in S-C bands. This will address MDA requirement for simultaneous S-C band telemetry transmission as mentioned in the solicitation and we will need a single wideband PA to achieve the 10Watt peak output power requirement. The complete WATT module will be a three PCB stack each with 2in x 3in dimensions.

* information listed above is at the time of submission.

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