Reworkable Epoxy Bonding for Superconductor Multi-chip Modules

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$149,876.00
Award Year:
2012
Program:
STTR
Phase:
Phase I
Contract:
N00014-12-M-0389
Agency Tracking Number:
N12A-014-0258
Solicitation Year:
2012
Solicitation Topic Code:
N12A-T014
Solicitation Number:
2012.A
Small Business Information
HYPRES. Inc.
175 Clearbrook Road, Elmsford, NY, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
103734869
Principal Investigator:
Deepnarayan Gupta
VP Research and Developme
(914) 592-1190
gupta@hypres.com
Business Contact:
Steve Damon
Assistant Controller
(914) 592-1190
sdamon@hypres.com
Research Institution:
University of Arkansas
Dennis W Brewer
210 Administration Building
Fayetteville, AR, 72701-1201
(479) 575-3845
Nonprofit college or university
Abstract
HYPRES, in collaboration with University of Arkansas (UA), proposes to develop a method for manufacturing superconductor multi-chip modules (MCMs) using nano-engineered cryogenic adhesives. A superconductor MCM comprises a carrier and several flipped chips. Before final assembly on the carrier, these chips need to be screened by temporarily attaching each one to another carrier with active test circuitry. Therefore, a detachable die attachment process is needed for selecting a set of known good die. In Phase I, a set of active carriers will be fabricated and qualified by testing along with a set of chips for mounting on them. The best composition of the adhesive will be obtained by conducting a series of experiments on adhesion strength, thermal and electrical conductivity, and removal without damage to the carrier and the chip. This will provide a platform for developing a two-chip MCM, with chips such as analog-to-digital converters flipped on top of a carrier with digital circuitry, during the Phase I option period in preparation for more complex MCMs.

* information listed above is at the time of submission.

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