Sintered Polymeric Composites with Very High Transverse Thermal Conductivity (PDRT08-019)

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-10-C-0129
Agency Tracking Number: A2-4037
Amount: $729,993.00
Phase: Phase II
Program: SBIR
Awards Year: 2010
Solicitation Year: 2008
Solicitation Topic Code: A08-029
Solicitation Number: 2008.2
Small Business Information
9431 Dowdy Drive, San Diego, CA, -
DUNS: 838266369
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Matt Thompson
 Principal Investigator
 (858) 444-1831
Business Contact
 Steven Sherman
Title: V.P ., Business Administr
Phone: (858) 444-1826
Research Institution
A six month program was executed with the goal of developing a novel thermally conductive composite material utilizing TLPS resin formulations created by Creative Electron, of San Marcos, CA, and composites design and manufacturing expertise from DR Technologies, Inc., of San Diego, CA, to develop a through thickness enhanced thermal conductivity composite material and provide material examples of thermal testing results, as well as consolidation quality. Results varied, but a high through thickness thermal conductivity was measured repeatedly using a flash thermography method at 16.2 W/m K. Densities for the various specimens ranged in the area of aluminum (2.7 g/cc), but some samples weighed in at something in excess of 4 g/cc due to excessive resin and flux content. A Phase II effort was laid out to investigate alternative structural preforms that would contribute further to the through thickness thermal conductivity, as well as leverage the lessons learned from the Phase I effort for improving the homogenaeity and processability of the TLPS/carbon fiber product, for potential use in missile airframes and secondary aircraft/space structures. A path forward to develop early production as well as a defined structural test plan to optimize thermal and structural performance of the TLPS/continuous carbon fiber reinforced conductive composite.

* Information listed above is at the time of submission. *

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