Coated carbon nanotubes as high conductivity thermal interface materials

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$749,750.00
Award Year:
2012
Program:
STTR
Phase:
Phase II
Contract:
FA9550-12-C-0061
Award Id:
n/a
Agency Tracking Number:
F09B-T22-0059
Solicitation Year:
2009
Solicitation Topic Code:
AF09-BT22
Solicitation Number:
2009.B
Small Business Information
8100 Shaffer Parkway, Suite #130, Littleton, CO, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
148034408
Principal Investigator:
SayangdevNaha
Research Engineer
(303) 792-5615
sayann@adatech.com
Business Contact:
CliftonBrown, Jr.
President&CEO
(303) 792-5615
cliffb@adatech.com
Research Institute:
University of Colorado at Boulder
Joan H Eaton
Room 479, Campus Box 572
3100 Marine Street
Boulder, CO, 80309-0572
(303) 492-6221

Abstract
ABSTRACT: Thermal interface materials (TIMs) constitute an essential part of thermal management which is quickly becoming the limiting factor in high power, high functional density, and increasingly small-sized electronics for future U.S. Air Force (AF) platforms. Examples of critical applications of interest to the AF include that require improved thermal management include modern aircraft, directed energy systems, and satellites. TIMs aim to ensure a continuous thermal conductivity path between the heat source and heat sink/dissipater, thus permitting the efficient operation of electronics. The major impediment to achieving reliable TIMs is high thermal interfacial resistance, which increases over time due to introduction of air pockets and the loss of contact between the meshing surfaces under thermal cycling. To address this need, ADA Technologies, Inc., in collaboration with the University of Colorado, Boulder proposes a novel approach to synthesize high-performance TIMs based on reduction of interfacial thermal resistance via electronic conduction. ADA"s proposed TIM aims to realize significant improvements of the current state-of-the-art in thermal performance and reliability. Material development selection and fabrication efforts will be based on systematic recommendations from a detailed quantum mechanics-based thermal transport model developed at CU Boulder. BENEFIT: ADA has designed our efforts to realize high-performance TIMs offering significant improvements over the current state-of-the-art. If successful, ADA"s technology will permit the development and usage of electronics that offer higher power and faster operating speeds by providing more efficient heat management. This will directly benefit capabilities in next generation AF efforts such as those anticipated in military aircraft, directed energy systems, satellites, and avionics. Furthermore, this technology will have direct benefits in many commercial electronics including personal electronics (e.g., laptops, cell phones, music players) and civilian aircraft, spacecraft, and other microelectronics.

* information listed above is at the time of submission.

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