Real-time Spectral Band Optimization for Unmanned Aerial Systems (UAS) Hyperspectral Camera

Award Information
Agency:
Department of Defense
Amount:
$749,888.00
Program:
SBIR
Contract:
N68335-10-C-0074
Solitcitation Year:
2008
Solicitation Number:
2008.2
Branch:
Navy
Award Year:
2010
Phase:
Phase II
Agency Tracking Number:
N082-155-0866
Solicitation Topic Code:
N08-155
Small Business Information
DSPCon
380 Foothill Road, Bridgewater, NJ, -
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
798640108
Principal Investigator
 Mitchell Wlodawski
 Scientist
 (908) 722-5656
 msw@dspcon.com
Business Contact
 Al Brower
Title: President
Phone: (908) 722-5656
Email: anb@dspcon.com
Research Institution
N/A
Abstract
This Phase II effort develops a prototype for an integrated near real-time solution capable of determining optimal multi-spectral bands for target detection, storing complete mission data, and parsing resultant data and metadata for transmission of hyperspectral imaging results. This design, referred to as the “Optimized Hyperspectral Camera System” (OHCS), leverages DSPCon’s approach to designing electronic boards and system architectures that meet strict Size, Weight, and Power (SWaP) consumption requirements, along with Sarnoff Labs world-class, innovative spectral analysis algorithms that can distinguish targets from clutter, even with minimal a priori target information and no a priori clutter information. The OHCS prototype will be demonstrated on a small, tactical Unmanned Aerial Vehicle (UAV), the Silver Fox. The OHCS will provide an unprecedented combination of performance and minimal SWaP to accommodate a demanding on-board application on a UAV platform. The DSPCon design approach is based on high performance, modular (plug and play), small footprint, rugged, air-cooled or conduction-cooled, function-specific boards that communicate over a high speed serial I/O fabric. This approach enables the design to meet the needs of environments where minimizing SWaP is critical, as is allowing easy upgrades and expansion of system capacity with a plug-and-play structure.

* information listed above is at the time of submission.

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